eprintid: 56196
rev_number: 1
eprint_status: archive
userid: 1
dir: disk0/00/05/61/96
datestamp: 2026-05-26 15:48:23
lastmod: 2026-05-26 15:48:23
status_changed: 2026-05-26 15:48:23
type: article
metadata_visibility: show
sword_depositor: 1
creators_name: o’g’li, Mardonov Abbos Akbar
creators_name: Mirmahmudovich, Miralimov Mirrahim
title: BINOLARNI SEYSMIK HIMOYA QILISH QURILMALARI.
ispublished: pub
subjects: seysmik izolyatsiya, seysmik damping, seysmik himoya, damping, iqtisodiy samaradorlik.
keywords: seysmik izolyatsiya, seysmik damping, seysmik himoya, damping, iqtisodiy samaradorlik.
note: Imported from Universal Publishings (OAI id oai:ojs.pkp.sfu.ca:article/3974)
abstract: Ushbu maqolada seysmik himoya qilishning zamonaviy usullari muhokama qilinadi. Seysmik izolyatsiya masalasini hal qilishda oddiy yondashuv - tuzilmalarning qattiqligi va mustahkamligini oshirish oddiy konstruktiv dizayndagi ko'pgina binolar uchun ishlatilishi mumkin, ammo maxsus usullardan foydalanish yuqori ishonchlilikni saqlab, qurilish xarajatlarini kamaytirishi mumkin. Bundan tashqari, murakkab, noyob va baland binolar uchun an'anaviy yondashuvdan foydalanish deyarli imkonsiz bo'lishi mumkin. Seysmik himoyaning yangi samarali usullari zarur. Bunday yechimlar og'irlik va bikirlikni o'zgartirishni, uning harakatlari va tezligiga qarab mos tizimni tanlashni o'z ichiga oladi. Shunday qilib, to'g'ri loyihalash bilan seysmik himoyadan foydalanish quyidagi ko'rsatkichlarni sezilarli darajada oshirishi mumkin: binoning ishonchliligi, xavfsizligi va konstruksiyaning iqtisodiy tejamkorligini.
date: 2024-01-24
date_type: published
publisher: "Research Science and Innovation house" LLC
official_url: https://universalpublishings.com/index.php/jusr/article/view/3974
id_number: oai:ojs.pkp.sfu.ca:article/3974
full_text_status: none
publication: Journal of Universal Science Research
citation:   o’g’li, Mardonov Abbos Akbar, Mirmahmudovich, Miralimov Mirrahim  (2024) BINOLARNI SEYSMIK HIMOYA QILISH QURILMALARI.  Journal of Universal Science Research.